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Products using functional materials are used as peripheral materials for the memories and IC elements of notebook personal computers, cell phones, digital cameras, etc., insulating films and protective films for semiconductors, coating materials that make use of excellent transparent properties and heat resistance, etc. It is said that polyimide-based adhesive layers of high heat resistance will take the place of epoxy-based adhesive agents used in electronic parts and become essential for the next-generation electronic parts. With an eye on such fields, Manac produces "ODPA-M" and "PEPA" as polyimide ingredients of high functionality and shall engage in further application research and development in these fields. |
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Polyimide resins of excellent heat resistance and insulating properties are used in electronic-material-related products. By using Manac's "ODPA-M" (oxydiphthalic anhydride), which we have developed on our own, functions that have not been seen up until now can be added to "polyimides." |
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(1) Polyimides using ODPA-M are excellent in transparent properties and can be used in optical material applications.
(2) By using ODPA-M, polyimides can be made suitably soft and adjusted in Tg.
(3) By softening by heat, parts can be adhered. |
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- Transparent films added with heat resistance
- Optical material applications
- Adhesive agents
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We have succeeded in achieving industrial production of "PEPA" (phenylethyl phthalic anhydride), which enables structural polyimides of high strength to be obtained and is being noted by NASA, the Polyimide Research Association, etc. as a key compound for new materials development.
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- Ultrahigh heat resistant materials
- Molding materials
- Aerospace materials
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Development under a variety of research themes are underway at the "Kazusa Laboratory," which is our R & D base.
(1) Application research on ODPA-M We shall search for new functions for further expansion of applications.
(2) Development of transparent polyimides Films using ODPA-M that are high in transparent properties and have excellent heat resistance are being studied.
(3) Development of applications of polyimide varnish The effects of adhesion of polyimides to copper, stainless metals, and inorganic glass are being pursued.
(4) Research on ethynyl compounds With "PEPA" as a base, we are engaging in research towards improving the strengths of resins. |
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